DIOTEC Electronics Corp. manufactures high power diodes and rectifiers. A Lead, Tin, Silver solder is used in all products for die attachment. Specifically, all die attach solder is 92.5% lead, 5% Tin, and 2.5% Silver with a melting point of approximately 290^OC. This type of solder is specifically exempted in the RoHS Directive (See Annex to the RoHS Directive below).

Additionally, the following points should be noted:

• None of the other materials identified in the RoHS Directive) are contained in, nor used in the manufacture of, DIOTEC's products.

• At this time, no changes are planned nor needed in product marking, packaging, etc because of the RoHS/WEEE requirements.

• All exposed terminals are silver, nickel, or tin plated. None contain any amount of lead.